| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount a MEMS gas sensor on a printed board without using die bonding nor wire bonding. <P>SOLUTION: A gas sensing unit and a plurality of pads connected to the gas sensing unit are arranged in a hollow section of a semiconductor chip. In a gas permeable ceramic package or a glass package, wiring is provided to a side of the package on the semiconductor chip side and a side opposite to the chip side, and the sides are connected. A plurality of pads are flip-chip connected to the wiring on the side of the package at the chip side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
