| 摘要 |
An absorbing method and apparatus for rear side laser process is disclosed. A conductive plate contacts or separates above a flexible substrate which is deposited a conductive film therebelow. A power source electrically connects the conductive plate and the conductive film, or only the conductive plate. After the power source provides voltages, a Coulomb electrostatic force is produced between the conductive plate and the conductive film, so as to absorb the flexible substrate and the conductive film. A light source is disposed above the conductive plate and emits a laser beam which in series passes through the conductive plate and the flexible substrate, and then focuses on rear side of the conductive film to process. Therefore, it is able to avoid the flexible substrate bent or drooping, and improve yield rate. |
