发明名称 |
Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure |
摘要 |
To provide an insulating resin film, which contains: a first adhesive layer, and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film. |
申请公布号 |
US2012125671(A1) |
申请公布日期 |
2012.05.24 |
申请号 |
US201113309855 |
申请日期 |
2011.12.02 |
申请人 |
SATO DAISUKE;NISHIMURA JUNICHI;ODAKA RYOSUKE |
发明人 |
SATO DAISUKE;NISHIMURA JUNICHI;ODAKA RYOSUKE |
分类号 |
H05K1/02;B32B7/12;B32B37/12 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|