PROCEDIMENTO PER LA PRODUZIONE DI CHIP A SEMICONDUTTORE, PROCEDIMENTI DI MONTAGGIO E CHIP A SEMICONDUTTORE PER MONTAGGIO VERTICALE SU SUPPORTO DI CIRCUITO STAMPATO

摘要

A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described.