| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in storage stability without decrease in the photosensitivity after long-term storage, excellent in microprocessing properties, developability, low-temperature curability, electric insulation reliability of a cured film, heat resistance against soldering, resistance against organic solvents, flame retardancy and the like. <P>SOLUTION: The photosensitive resin composition comprises at least: an agent (A) containing (a1) a compound having a carboxyl group and no photosensitive group; and an agent (B) containing (b1) an epoxy resin and (b2) an oxime ester photopolymerization initiator. The (b1) epoxy resin is present in a solid state in the agent (B) at room temperature (25°C). <P>COPYRIGHT: (C)2012,JPO&INPIT |
