| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition suitable for the use as an insulation layer of a multi-layer printed circuit board, and achieving the insulation layer (interlayer insulation layer) of which roughened surface exhibits high close adhesion against a plated conductor even though the roughness of the roughened surface after the roughening is relatively small. <P>SOLUTION: This epoxy resin composition is characterized by containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenol-based curing agent having a mean hydroxy group-containing ratio P [average value of ((the total number of hydroxy groups)/(the total number of benzene rings))] satisfying 0<P<1, (C) a phenoxy resin and (D) rubber particles. <P>COPYRIGHT: (C)2012,JPO&INPIT |
