| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide substrate processing equipment capable of preventing a support part for supporting a substrate holder from being tilted due to the difference in pressure, and a method for manufacturing a semiconductor device. <P>SOLUTION: Substrate processing equipment comprises: a load lock chamber; a gas supply part and a gas exhaust part for controlling an atmosphere in the load lock chamber; a boat for holding a wafer in the load lock chamber; a shaft and a fixing base 56 for supporting the boad; a lifting device for raising and lowering the shaft and the fixing base 56; and a connecting member 60 fixed to the fixing base 56 and connected to the lifting device by a surface. The load lock chamber is adjacent to an EFEM for transporting a wafer in an atmospheric-pressure atmosphere, and a transporting chamber adjacent to a processing chamber for processing a wafter, for transporting a wafer in a vacuum atmosphere lower in pressure than the atmospheric pressure. <P>COPYRIGHT: (C)2012,JPO&INPIT |
