PHOTOSENSITIVE COMPOSITE AND BUILD-UP INSULATION FILM WITH THE SAME, AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE BUILD-UP INSULATION FILM

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive composite for improving a manufacturing process efficiency of a printed circuit board, and to provide a build-up insulation film with the same, and a method for manufacturing a circuit board using the build-up insulation film.

SOLUTION: The method for manufacturing a circuit board includes: a step of preparing a photosensitive composite; a step of preparing a build-up insulating film by casting the photosensitive composite into a film made of polyethylene terephthalate (PET) material; a step of stacking the build-up insulation film on the board; a step of forming a via hole in the build-up insulation film by using a photolithography process; and a step of forming a conductive via in the via hole.

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