| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface inspection device capable of searching for a flat inspection range allowing high accuracy nondestructive measurement of surface roughness of a wafer with a pattern without visual observation. <P>SOLUTION: A surface inspection device inspects surface roughness of a wafer 200 by measuring scattered light intensity of scattered light generated by irradiation light to be emitted by associating the scattered light intensity with measurement coordinates on the wafer 200 with a pattern. In the surface inspection device, a control part extracts the measurement coordinates of the scattered light intensity that is a lower limit threshold or more, sets an inspection range 406 of surface roughness inspection within a partial layout 405a of a part of the entire layout 401 of a pattern corresponding to a periphery of the extracted measurement coordinates, and obtains the surface roughness in the inspection range 406. <P>COPYRIGHT: (C)2012,JPO&INPIT |
