发明名称 LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
摘要 <p>A workpiece (W) provided with a surface layer (3) and an underlayer (2), layered one on top of the other, is irradiated from the surface-layer side towards the underlayer side with laser light (LZ) for which the optical absorption coefficient is higher in the underlayer (2) than in the surface layer (3), thereby removing just the surface layer (3) via ablation of the underlayer (2).</p>
申请公布号 WO2012067228(A1) 申请公布日期 2012.05.24
申请号 WO2011JP76657 申请日期 2011.11.18
申请人 MIYACHI CORPORATION;MIURA HIDEO 发明人 MIURA HIDEO
分类号 B23K26/36;B23K26/00;B23K26/073;B23K26/08;H01L31/04 主分类号 B23K26/36
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