| 摘要 |
Provided is an electronic device that is capable of effectively dissipating heat generated by heat-generating components mounted on a circuit board even if electronic components of different thicknesses are mounted on the bottom surface of the circuit board. In particular, the electronic device (1) is provided with a circuit board (2) on which heat-generating components (7) are mounted and a board fixation member (3) to which the circuit board (2) is fixed. A heat-dissipating section is formed on the back surface of the circuit board (2) in order to dissipate heat generated by the heat-generating components (7), and the board fixation member (3) is made of a heat-dissipating material that has heat dissipation properties. The board fixation member (3) has a base section (3a) that is positioned with a prescribed space from the bottom surface of the circuit board (2) and a fixation section (3b) that protrudes from the base section (3a) toward the circuit board (2) and has the heat-dissipating section fixed thereto.
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