APPARATUS OF COINING

摘要

PURPOSE: A coining apparatus is provided to improve bump yield by reducing the defective appearance of a bump and diffused reflection. CONSTITUTION: A coining portion(110) levels a surface of a bump projected from a surface of an insulating layer(11). The coining portion simultaneously pressurizes a plurality of bumps by covering a plurality of bumps at a time. A coating portion(120) is included in one side of the coined portion facing the bump. The coating unit reduces the bump from the coining portion. The heat resistance temperature of the coating unit is 200°C to 500°C.