| 摘要 |
<P>PROBLEM TO BE SOLVED: To shorten a test time by increasing the number of chips which can be measured at a time, without providing a special chip for a test in a wafer. <P>SOLUTION: A semiconductor device comprises a semiconductor wafer 10 formed with a plurality of semiconductor chips 11, a plurality of bonding pads 12 respectively formed on the plurality of semiconductor chips 11, two-way buffers 20 respectively provided on the plurality of bonding pads 12, and a common bus 21 for commonly connecting the two-way buffers 20 of the plurality of semiconductor chips. In a testing method of the semiconductor device, a base semiconductor chip 13 is selected in advance from the plurality of semiconductor chips, and a probe needle is brought into contact with the bonding pad 12 of the base semiconductor chip 13. A signal is supplied to the plurality of semiconductor chips 11 through the common bus 21, and the electrical characteristics of the plurality of semiconductor chips 11 are measured. <P>COPYRIGHT: (C)2012,JPO&INPIT |
