发明名称 |
SEMICONDUCTOR DEVICE HAVING POWER SUPPLY-SIDE AND GROUND-SIDE METAL REINFORCING MEMBERS INSULATED FROM EACH OTHER |
摘要 |
Provided is a semiconductor device which includes a wiring substrate; a semiconductor chip fixedly attached to a first surface of the wiring substrate; a power supply pad that is provided on a second surface opposite to the first surface of the wiring substrate, and supplies electric power to the wiring substrate; a ground pad that is provided on the second surface of the wiring substrate and grounds the wiring substrate; a power supply-side reinforcing member that is connected to the power supply pad and made of metal; a ground-side reinforcing member that is connected to the ground pad and made of metal; and an insulating part that insulates the power supply-side reinforcing member and the ground-side reinforcing member from each other.
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申请公布号 |
US2012126432(A1) |
申请公布日期 |
2012.05.24 |
申请号 |
US201013388285 |
申请日期 |
2010.08.20 |
申请人 |
INABA KENICHI;YOSHIKAWA MINORU |
发明人 |
INABA KENICHI;YOSHIKAWA MINORU |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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