FILM-LIKE RESIN COMPOSITION FOR SEALING AND FILLING SEMICONDUCTOR, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a film-like resin composition for sealing and filling a semiconductor, which is provided with a first layer composed of a first resin composition containing a thermosetting resin and a filler, and a second layer composed of a second resin composition containing a flux agent. The mass ratio of the filler in the second resin composition to the total quantity of the second resin composition is smaller than the mass ratio of the filler in the first resin composition to the total quantity of the first resin composition.