| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for fabricating a microelectronic assembly including a built-in thermoelectric cooler (TEC) for cooling a microelectronic device, and a system including the microelectronic assembly. <P>SOLUTION: The method includes providing a microelectronic device, and fabricating the built-in TEC directly onto the microelectronic device such that there is no mounting material between the built-in TEC 120 and the microelectronic device. The built-in TEC comprises at least one coupling of an N-type electrode 116, a P-type electrode 118, and conductive elements 122-134 that couple the N-type electrode 116 and P-type electrode 118 to one another in series. <P>COPYRIGHT: (C)2012,JPO&INPIT |
