| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate support having dynamic temperature control ability during plasma processing of a substrate. <P>SOLUTION: A substrate support 40 useful for a plasma processing apparatus includes a metallic heat transfer member 48 and an overlying electrostatic chuck 50 having a substrate support surface. The heat transfer member 48 includes one or more passages through which a liquid is circulated to heat and/or cool the heat transfer member 48. The heat transfer member has a low thermal mass and can be rapidly heated and/or cooled to a desired temperature by the liquid, so as to rapidly change the substrate temperature during plasma processing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
