| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a condensation preventive structure of a substrate capable of preventing the condensation of a substrate, decreasing restriction to the layout design of an electronic unit on the substrate, and saving a manufacturing cost of an electronic device as compared with a case using a coating agent. <P>SOLUTION: A condensation preventive structure of a substrate 60 prevents the generation of condensation on the substrate 60 stored in a housing 10 having an opening in which outside air flows. A heat sink 70 is provided in the housing 10. The heat sink 70 is made to abut on a CPU 61 in the housing 10 and a near-field area of a connector insertion port 13 on the substrate 60. <P>COPYRIGHT: (C)2012,JPO&INPIT |
