ELECTROCONDUCTIVE MATERIAL, METHOD OF CONNECTION WITH SAME, AND CONNECTED STRUCTURE

摘要

Provided is an electroconductive material in which, when the electroconductive material is used as, for example, a solder paste, a first metal and a second metal show satisfactory diffusibility during a soldering step to yield a high-melting intermetallic compound at a low temperature in a short time, and in which the first metal remains very little after the soldering, resulting in excellent high-temperature strength. Also provided are: a connection method in which the electroconductive material is used and which attains high connection reliability; and a connected structure. The electroconductive material has been configured so as to comply with the requirements that the electroconductive material includes metal components comprising a first metal and a second metal, the second metal having a higher melting point than the first metal, that the first metal is Sn or an alloy that contains at least 70 wt.% Sn, and that the second metal is a metal or alloy which yields, together with the first metal, an intermetallic compound that shows a melting point of 310ºC or higher, the difference in lattice constant between the second metal and the intermetallic compound to be yielded on the periphery of the second metal being 50% or more. The proportion of the second metal in the metal components is 30 vol.% or more. A Cu-Mn alloy or a Cu-Ni alloy is used as the second metal.