| 摘要 |
<p>The invention discloses a substrate of a Printed Circuit Board (PCB), which consists of at least two layers of basic substrates, wherein the basic substrate is an FR4 copper clad board (100) of 10 microns order. The invention provides furthermore a manufacturing method of the PCB substrate, which comprises the following steps: laminating at least two layers of FR4 copper clad boards (100) into a whole; and laser drilling the laminated FR4 copper clad boards (100) to make laser blind holes (110). Because the need of forming a substrate core is avoided in the manufacturing process of the PCB substrate, the PCB substrate is drilled totally by laser during the drilling,and thereby the manufacturing efficiency and the drilling precision are improved.</p> |
