| 摘要 |
PURPOSE: A 3D stacked package through flip chip bonding and a manufacturing method thereof are provided to prevent the degradation and damage of a monomer by including a rigid plate which is thicker than a semiconductor chip. CONSTITUTION: A semiconductor chip(10) is mounted on a flexible board(20). The flexible board includes a conductive pattern(2) and via(v). The conductive pattern is formed on a mounting surface which the semiconductor chip is mounted on. The conductive pattern and via are connected. The via passes through the mounting surface and an opposite side of the mounting surface. |
