| 摘要 |
PURPOSE: A system and method for manufacturing a semiconductor package are provided to cut an individual grid array after arraying a laminating film and a metal plating film in a grid shape, thereby increasing production. CONSTITUTION: A semiconductor chip is mounted on an opening of a substrate in which a plurality of grid arrays is placed(S520). A film is laminated to cover all the grid arrays(S530). A boundary line between the grid arrays is grooved in the film(S540). Metal is plated on the film(S550). Each grid array is cut(S560).
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