WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To form a hole with high location accuracy in a wiring board.

SOLUTION: In a method of manufacturing a wiring board 20 on which wiring layers 23 and resin layers 24 are stacked and in which a hole 30 for mounting an electronic component is provided, the resin layers 24 corresponding to openings 25 are removed using opening patterns 26 having the openings 25 formed in the wiring layers 23 as a mask to form openings 28 in the resin layers 24, thereby forming the hole having the openings 25 and the openings 28.

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