发明名称 WIRING BOARD FOR INSPECTING ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board for inspecting an electronic component, along with a method of surely manufacturing the wiring board, which contains a resin insulating part where a wiring layer formed among a plurality of resin insulating layers is precisely arranged at a predetermined position. <P>SOLUTION: A wiring board 1 for inspecting an electronic component includes a resin insulating part RZ which contains a plurality of resin insulating layers z1-z4 stacked in the thickness direction, and wiring layers 6-8 arranged among the resin insulating layers z1-z4. In the wiring board 1 for inspecting electronic component, the resin insulating layers z1-z4 include a first resin layer 4 made of a thermoset resin, and a pair of second resin layers 5 made of a thermoplastic resin and arranged on both surfaces of the first resin layer 4. A non-conduction via conductor dv1 which penetrates the first resin layer 4 and the pair of second resin layers 5 with only one end connected to the wiring layers 6-8 or a non-conduction via conductor dv2 in which only one end is connected to the wiring layers 6 and 7, while penetrating one of the second resin layers 5 adjoining the wiring layers 6 and 7, and the other end stays in the first resin layer 4, is formed in the resin insulating layers z1-z4. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012099591(A) 申请公布日期 2012.05.24
申请号 JP20100244978 申请日期 2010.11.01
申请人 NGK SPARK PLUG CO LTD 发明人 TOJO TAKATOSHI;HIRANO SATOSHI;NAGAYA YOSHIAKI;FUKUI RYOTA;IWATA MUNEYUKI;SUZUMURA SHINJI
分类号 H05K3/46;G01R1/073 主分类号 H05K3/46
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