| 发明名称 |
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable anisotropic conductive film excellent in chip crack resistance and chip peeling resistance and also excellent in connection reliability, and a connection structure using the anisotropic conductive film. <P>SOLUTION: The anisotropic conductive film includes at least two layers, and has a minimum interlaminar fracture strength after hardening of 2 to 9 MPa. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012099404(A) |
申请公布日期 |
2012.05.24 |
| 申请号 |
JP20100247618 |
申请日期 |
2010.11.04 |
| 申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
OTANI AKIRA;IKEDA KAZUMASA;KIZAKI YOICHI |
| 分类号 |
H01R11/01;H01B5/16;H01L21/60;H01R43/00;H05K3/32 |
主分类号 |
H01R11/01 |
| 代理机构 |
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