发明名称 |
Material Structure in Scribe Line and Method of Separating Chips |
摘要 |
A method for manufacturing a chip is disclosed. The method comprises forming a material structure in a kerf adjacent the chip on a wafer. The method further comprises selectively removing the material structure in the kerf and dicing the wafer. A semiconductor wafer is disclosed. The semiconductor wafer comprises a plurality of chips and a plurality of kerfs. The kerfs separate the chips from each other. At least one kerf comprises a kerf framing. The kerf framing is arranged directly adjacent a side of the at least on chip.
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申请公布号 |
US2012126228(A1) |
申请公布日期 |
2012.05.24 |
申请号 |
US20100952403 |
申请日期 |
2010.11.23 |
申请人 |
FISCHER THOMAS;OPOLKA HEINZ |
发明人 |
FISCHER THOMAS;OPOLKA HEINZ |
分类号 |
H01L23/544;H01L21/78 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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