| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser unit which improves thermal conductivity from a frame laser to a laser holder and positioning accuracy of the frame laser relative to the laser holder. <P>SOLUTION: A laser unit 1 includes a frame laser 2, in which a semiconductor laser chip 22 is mounted on a surface 21a of a substrate 21 and a frame part 24 is integrally formed with the substrate 21 so as to enclose the semiconductor laser chip 22, and a laser holder 3 where an installation surface 31a, on which the frame laser 2 is placed, is provided. The frame laser 2 is placed so that a rear surface 21b of the substrate 21 contacts with the installation surface 31a. In the laser holder 3, a recessed part 31b is formed on the installation surface 31a and a resin part 4 is formed on the recessed part 31b with a filled resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
