发明名称 SEMICONDUCTOR MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor module having a frame usable for the constitution of circuit for a plurality of converters and power-factor improving circuits. <P>SOLUTION: The semiconductor module comprises an inverter part having an element mounting frame in which elements are mounted thereon, and a wiring frame formed of fine line part having uniform wide, and for forming an inverter by connecting them through wires; and a general-purpose frame part having the element mounting frame in which elements are mounted thereon, a frame having fine line part and wide part and in which elements are not mounted thereon and a wiring frame formed of fine line part having uniform wide, and for forming a converter or a power-factor improving circuit connecting them through wires. The inverter part and the general-purpose frame are mounted in one package. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012099842(A) 申请公布日期 2012.05.24
申请号 JP20110290218 申请日期 2011.12.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 KATO MASAHIRO;IWAGAMI TORU
分类号 H01L25/07;H01L23/48;H01L25/18;H02M7/48 主分类号 H01L25/07
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