| 摘要 |
PURPOSE: An apparatus for measuring the thickness of a wafer is provided to measure wafer thicknesses having various diameters by changing the location of a probe according to the diameter of a wafer. CONSTITUTION: An upper plate(40) is combined with a plurality of guide shafts(41). A top moving plate(20) is prepared at a lower portion of the upper plate. A lower moving plate(30) is prepared at the lower part of the top moving plate. A measuring unit is composed of a lower probe and an upper probe. A driving device(100) measures the thickness of a wafer by running the top and lower probes.
|
