A FABRICATING METHOD FOR CERAMIC ELECTRONIC DEVICE

摘要

PURPOSE: A ceramic electronic component and a fabricating method thereof are provided to prevent a chip from being distributed in a chip mounting process since a mooning phenomenon is prevented when an outer electrode of a ceramic electronic component is formed. CONSTITUTION: A ceramic electronic component includes a ceramic sintered body which is formed by alternatively laminating a plurality of ceramic layers and inner electrodes. The ceramic electronic component includes first and second external electrodes formed in both ends of the ceramic sintered body. The first and second external electrodes connect an inner electrode and an outer element. The ceramic sintered body is formed by laminating the plurality of ceramic layers. One or more inner electrodes are formed between dielectric layers. An external electrode paste(20) is formed on a surface(30) of the ceramic sintered body. The external electrode paste is formed to be inclined as much asθdegree to the surface of the ceramic sintered body.