SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To suppress reduction in reliability which is caused by a matter that an interface between a sealing resin and the other member is exposed on a lateral face.

SOLUTION: A semiconductor device has: a lower side semiconductor chip 10 having an input/output pad on its surface; a lower side mold resin body 13 surrounding a lateral face of the lower side semiconductor chip, and having a surface that has a shape extending the surface of the lower side semiconductor chip to outside; an upper side semiconductor chip 20 laminated above the lower side semiconductor chip, and having an input/output pad on its surface; an upper side mold resin body 25 molding the upper side semiconductor chip; a re-wiring layer 17 laying around at least a part of the input/output pad 12 of the lower side semiconductor chip or the input/output pad 22 of the upper side semiconductor chip along the surface of the lower side mold resin body or the surface of the upper side semiconductor chip or its extended surface; external connection metal posts 18 and 19 formed on the re-wiring layer and whose top part is exposed from the upper side mold resin body; and ball-like external connection terminals 30 connected onto the external connection metal posts.

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