| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate the need of a work for inputting information on a movable range in the XY direction where a push-up pot does not interfere with a circular opening edge part of a wafer pallet, in a die feeding device. <P>SOLUTION: In a die feeding device 11, a push-up pot pushes up a sticking part of a die 21 to be absorbed in a dicing sheet from directly below when the divided die 21 is absorbed from a wafer on the dicing sheet stretched on a wafer pallet 22 by an absorption nozzle. In the die feeding device 11, an information recording unit 35 in which wafer information, such as a size or the like, on the wafer on the dicing sheet is described is provided to the wafer pallet 22. One in which a code, such as a two-dimensional code or the like, representing the wafer information is recorded on the top face thereof is used as the information recording unit 35, and a camera 24 for imaging the die is used as an information reading unit. The code of the information recording unit 35 is imaged by the camera 24 to perform image processing. Thereby, the code is read out, and a movable range of the push-up pot in the XY direction is automatically set. <P>COPYRIGHT: (C)2012,JPO&INPIT |
