发明名称 |
IMPRINTING METHOD, IMPRINTING APPARATUS AND MEDIUM |
摘要 |
According to one embodiment, there is provided an imprinting method for applying a first hardening resin material on a substrate to be processed and transferring a pattern of a semiconductor integrated circuit formed on a template onto the substrate to be processed on which the first hardening resin material is applied, wherein a second hardening resin material with higher separability than the first hardening resin material is applied on at least part of the outer periphery of an area in which the pattern is formed by one transferring. |
申请公布号 |
US2012129279(A1) |
申请公布日期 |
2012.05.24 |
申请号 |
US201113230197 |
申请日期 |
2011.09.12 |
申请人 |
MATSUOKA YASUO;OTA TAKUMI;INANAMI RYOICHI |
发明人 |
MATSUOKA YASUO;OTA TAKUMI;INANAMI RYOICHI |
分类号 |
H01L21/66;B05C9/12;B05C9/14;B05C11/00;B05C11/02 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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