发明名称 |
PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND LED MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate which has excellent thermal conductivity, heat resistance, drill workability and flame retardancy. <P>SOLUTION: In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80-200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2-15 μm and (B) magnesium oxide having average particle diameter (D50) of 0.5-15 μm, and the blending ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3-3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012097158(A) |
申请公布日期 |
2012.05.24 |
申请号 |
JP20100244145 |
申请日期 |
2010.10.29 |
申请人 |
PANASONIC CORP |
发明人 |
MATSUDA TAKASHI;KOMORI KIYOTAKA;NOZUE AKIYOSHI;SUZUE TAKAYUKI;NISHINO MITSUNAGA;ASAHI TOSHIYUKI;TANI NAOYUKI;KITAGAWA SHOYO |
分类号 |
C08J5/24;B32B15/08;H05K1/03 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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