| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for preventing influences of a processing portion for division which is processed for dividing a printed circuit board after component mounting, when setting a reference surface which becomes a reference of a hight, to a solder point to be measured on the printed circuit board and determining a height of a solder with respect to the reference surface. <P>SOLUTION: A displacement sensor optically measures a printed circuit board on which a solder is printed and outputs displacement information indicating a displacement in a height of the printed circuit board, and a dividing line determination section detects a processing portion for division for dividing the printed circuit board on the basis of the displacement information and outputs a dividing line of the printed circuit board as dividing line information. Reference surface calculation area setting means sets a reference surface calculation area within an area inside the dividing line upon receiving the dividing line information, and reference surface calculation means sets a plane which is formed in the reference surface calculation area, as a reference surface on the basis of the displacement information within the reference surface calculation area. A displacement measuring section calculates a height of the solder at a solder point from the displacement information of the solder point and the set reference surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
