| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce influences by outside air on a high-frequency circuit while avoiding deterioration of electromagnetic characteristics by a configuration that can be produced at low cost. <P>SOLUTION: A high-frequency device module has: a high-frequency device 15 configured so that at least one of signal input and signal output between a high-frequency circuit and the exterior is performed via electromagnetic waves of a waveguide mode; and a package having a device incorporation space for incorporating the high-frequency device, and to which a waveguide path 24 is formed so as to penetrate through housing walls 21 and 22 forming the device incorporating space. The waveguide path is connected to the high-frequency device incorporated in the package. A shielding plate 25 made of a dielectric material arranged so as to shield the waveguide path is provided. The shielding plate restricts that outside air enters into the high-frequency device through the waveguide path, and is formed of a material and a thickness making electromagnetic waves pass thorough. <P>COPYRIGHT: (C)2012,JPO&INPIT |
