发明名称 |
NON-HALOGEN, NON-PHOSPHORUS THERMOSETTING RESIN COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition not containing a halogen- or phosphorus-based flame retardant. <P>SOLUTION: The non-halogen, non-phosphorus thermosetting resin composition 1 is a varnish formed by mixing a curing agent mixture 10, an epoxy resin mixture 11 and an inorganic additive 12. The curing agent mixture 10 is prepared by mixing a phenolphthalein modified benzoxazine phenol curing agent and an amino triazine novolak resin curing agent. The epoxy resin mixture 11 is prepared by adding a bisphenol F epoxy resin to an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and mixing them. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012097237(A) |
申请公布日期 |
2012.05.24 |
申请号 |
JP20100248116 |
申请日期 |
2010.11.05 |
申请人 |
UNIPLUS ELECTRONICS CO LTD |
发明人 |
CHANG CHUNG-HAO;YEH CHIA HSIU;LIN HUI MIN |
分类号 |
C08L63/00;C08K3/00 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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