发明名称 NON-HALOGEN, NON-PHOSPHORUS THERMOSETTING RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition not containing a halogen- or phosphorus-based flame retardant. <P>SOLUTION: The non-halogen, non-phosphorus thermosetting resin composition 1 is a varnish formed by mixing a curing agent mixture 10, an epoxy resin mixture 11 and an inorganic additive 12. The curing agent mixture 10 is prepared by mixing a phenolphthalein modified benzoxazine phenol curing agent and an amino triazine novolak resin curing agent. The epoxy resin mixture 11 is prepared by adding a bisphenol F epoxy resin to an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and mixing them. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012097237(A) 申请公布日期 2012.05.24
申请号 JP20100248116 申请日期 2010.11.05
申请人 UNIPLUS ELECTRONICS CO LTD 发明人 CHANG CHUNG-HAO;YEH CHIA HSIU;LIN HUI MIN
分类号 C08L63/00;C08K3/00 主分类号 C08L63/00
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