| 摘要 |
A heat dissipation structure (100) for a light source and a backlight module are provided. The heat dissipation structure (100) for the light source comprises at least one light string (10) having two side surfaces (121), and a heat dissipation base (20). The heat dissipation base (20) comprises a frame base (21) having an inner space (211), at least one opening (213) and an upper surface (214), and at least one elastic abutting wall (22) respectively having a joint surface (221), wherein the opening (213) is opened on the upper surface (214) of the frame base (21) and communicates with the inner space (211), the opening (213) has at least one opening edge (2131) respectively, the elastic abutting wall (22) is fixed on the opening edge (2131), the light string (10) is embedded inside the opening (213), and the joint surface (221) of the elastic abutting wall (22) joints to the side surface (121) of the light string (10), thereby increasing the contacting area between the light string (10) and the heat dissipation base (20), and relatively improving the heat dissipation efficiency and the using life of the light emitting diode package structure |
