| 摘要 |
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to arrange a wafer test related composition on a sawing region on the boundary of a scribe line of a wafer, thereby preventing a chip size increase due to the wafer test related composition. CONSTITUTION: A semiconductor chip(100) is formed on a predetermined region of a wafer. A wafer test block(WTB) and a wafer test pad(WP) are formed on the outer region of the predetermined region. A signal line electrically connects the wafer test block and the semiconductor chip. A through silicon via(TSV) penetrates the signal line in a vertical direction of the signal line. A switching device is electrically connected to the signal line. |
