| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which has a simple structure and is excellent in heat dissipation, a method of manufacturing the wiring board, and an electronic device in which an electronic component is mounted on the wiring board. <P>SOLUTION: The wiring board is such wiring board as an electronic component mounting region is provided on a first main surface and includes a heat sink which releases the heat generated by an electronic component mounted on the electronic component mounting region to the outside, a sealing resin which covers the heat sink in such manner as the first surface of the heat sink is exposed in the electronic component mounting region of the first main surface, an internal connection terminal which includes a terminal face that is electrically connected to an electrode of the electronic component, and an external connection terminal which includes a terminal face that is electrically connected to the internal connection terminal through wiring, for inputting/outputting signals to/from the outside. The sealing resin covers at least the first main surface side of the wiring and a second main surface side which is opposed to the first main surface, the internal connection terminal excluding the terminal face, and the external connection terminal excluding the terminal face. The first surface of the heat sink, the terminal face of the internal connection terminal, and the terminal face of the external connection terminal are exposed on the same flat surface on the first main surface side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
