发明名称 TRANSPORTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a transporting device capable of regulating horizontal movement of a semiconductor wafer even when the semiconductor wafer lifted in a noncontact state is warped or hung down in its outer peripheral section by self-weight. <P>SOLUTION: The transporting device includes a non-contact type suction holding part 21 provided in a center region 20a of a base part 20, and a regulating part 22 provided in an outer peripheral region 20b of the base part 20, for regulating horizontal movement of a work W. The regulating part 22 having a contact surface 223a with the work W is arranged in such a manner that the contact surface 223a can be vertically moved with respect to the base part 20. The contact surface 223a is vertically moved between a lower position and an upper position, the lower position at which the contact surface 223a is brought into contact with an outer peripheral portion upper surface W1 of the work W positioned below a center portion upper surface of the curved work W, the upper position to which the contact surface 223a at the lower position is pressurized onto a table 5 via the work W to be escaped upward from the lower position. Accordingly, the transporting device can regulate horizontal movement of a plate-like object even when the lifted work W is warped. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012099755(A) 申请公布日期 2012.05.24
申请号 JP20100248338 申请日期 2010.11.05
申请人 DISCO ABRASIVE SYST LTD 发明人 MINATO KOKICHI
分类号 H01L21/677 主分类号 H01L21/677
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