发明名称 SUBSTRATE HEATER AND SUBSTRATE HEATING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and a device for uniformly heating a large-size plate-like substrate by preventing the lifting of the substrate owing to thermal expansion. <P>SOLUTION: A substrate heater 1 operable to uniformly heat a plate-like substrate comprises at least: a heating plate 2 for heating the plate-like substrate 3 by placing and bringing the substrate on and into contact with the heating plate; a cover 4 for covering the heating plate 2 as if enveloping the plate; and a controller capable of controlling the heating plate 2 and the cover 4. The heating plate 2 includes, at least, a plurality of workpiece-receiving pins for supporting the plate-like substrate 3, a driving mechanism capable of controlling the workpiece-receiving pins by use of the controller, and a heating mechanism capable of controlling the heating plate 2 while by use of the controller. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012099607(A) 申请公布日期 2012.05.24
申请号 JP20100245309 申请日期 2010.11.01
申请人 TOPPAN PRINTING CO LTD 发明人 SAKAO KENJI
分类号 H01L21/027;G02F1/1335;G03F7/20 主分类号 H01L21/027
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