| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board allowing a wiring conductor including a fine semiconductor element connection pad to be formed, and preventing an external connection pad from being peeled. <P>SOLUTION: A wiring board includes: a first wiring conductor 3 having a semiconductor element connection pad 3a connected to an electrode T of a semiconductor element S, the first wiring conductor being formed on one main surface of an insulating substrate 1 using a first metal foil 8 as a base by a semi-additive method; and a second wiring conductor 4 having an external connection pad 4a connected to an external electric circuit board, the second wiring conductor being formed on the other main surface of the insulating substrate 1 using a second metal foil 10 as a base by the semi-additive method. The first metal foil 8 is adhered onto the insulating substrate 1 via a primer resin layer 2, and includes an adhesive surface to the primer resin layer 2 as a smooth surface having an Rz of 0.3 to 1.0 μm. The second metal foil 10 is adhered directly onto the insulating substrate 1, and includes an adhesive surface to the insulating substrate 1 as a roughened surface having the Rz of 1.5 to 3.0 μm. <P>COPYRIGHT: (C)2012,JPO&INPIT |
