| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition not containing halogen, having high glass transition temperature and excellent flexibility, electric insulation (migration resistance), adhesion, soldering heat resistance, and flame retardancy, and capable of providing a cured product that is suitably used for a flexible printed circuit board especially, and an adhesive sheet and a coverlay film using the same. <P>SOLUTION: The flame-retardant adhesive composition not including halogen is provided, which contains (A) a trifunctional epoxy resin not including halogen, (B) a phenoxy resin having a weight-average molecular weight of 10,000-100,000 and a glass transition temperature of 70°C or more, (C) a curing agent, and (D) a phosphazene compound. The adhesive sheet and the coverlay film using the same are also provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
