| 摘要 |
A movable stage on which an LED chip is placed is moved in horizontal directions (for example, the x-axis direction and the y-axis direction) under the control of a position adjusting section. A probe needle is brought into contact with a bonding electrode on the surface of the LED chip to apply a desired voltage to the LED chip. A light detecting section detects light from the LED chip. An optical characteristic measuring section measures, based on the results of detection by the light detecting section, optical characteristics of the LED chip. A laser light source removes a part of the surface of the LED chip by laser light. |
