CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR

摘要

Provided is a circuit substrate (100) equipped with a substrate (10) on which prescribed wiring has been formed; one or more electronic components (30) formed on the aforementioned substrate; and a resin cover part (50) comprising an insulating resin that covers at least one of the aforementioned electronic components. A resin outflow protective wall (70) is formed upright on the aforementioned substrate near the electronic component(s) covered by the aforementioned resin cover part, and by means of the aforementioned resin outflow protective wall the insulating resin that forms the aforementioned resin cover part covers the top face of the aforementioned electronic component(s) and accumulates in the region from the top face of the electronic component(s) to said protective wall.