发明名称 ASSEMBLY, METHOD FOR PRODUCTION OF THE ASSEMBLY, JOINT COMPOSITION, AND METHOD FOR PRODUCTION OF THE JOINT COMPOSITION
摘要 <p>There is provided a bonded article obtained by unitarily bonding two or more target articles to be bonded by means of a bonding material layer. The bonding material layer contains layer silicate, and the average linear thermal expansion coefficient ± 1000°C specified by the following formula (1) and the average linear thermal expansion coefficient ± 400°C specified by the following formula (2) of a test piece cut out from the bonding material layer satisfy the following formula (3): ± 1000°C = (l 1000°C - l 40°C ) / {l 40°C × (1273.15K - 313.15K)} (1) (where, l 1000°C represents length of the test piece at 1000°C, and l 40°C represents length of the test piece at 40°C), ± 400°C = (l 400°C - l 40°C ) / {l 40°C × (673.15K - 313.15K) } (2) (where, l 400°C represents length of the test piece at 400°C, and l 40°C represents length of the test piece at 40°C), |± 1000°C -± 400°C l ‰¤2.0×10 -6 /K (3).</p>
申请公布号 EP2133198(A4) 申请公布日期 2012.05.23
申请号 EP20080720842 申请日期 2008.02.26
申请人 NGK INSULATORS, LTD. 发明人 KAWAI, MASAAKI;TOMITA, TAKAHIRO;MORIMOTO, KENJI;KAWASAKI, SHINJI
分类号 B32B7/02;B01D39/20;B32B3/12;B32B7/12;C04B37/00;C09J1/00;C09J11/04;F01N3/02 主分类号 B32B7/02
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