METAL LAMINATED SUBSTRATE FOR USE AS AN OXIDE SUPERCONDUCTING WIRE MATERIAL, AND MANUFACTURING METHOD THEREFOR
摘要
Provided are a method of manufacturing a metal laminated substrate for an oxide superconducting wire and a metal laminated substrate for an oxide superconducting wire, where copper can have sharp biaxial texture and the formation of scratches and grooves on a surface of copper can be prevented. The method includes the steps of: removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300MPa to 1500MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
申请公布号
EP2455949(A1)
申请公布日期
2012.05.23
申请号
EP20100799591
申请日期
2010.07.08
申请人
TOYO KOHAN CO., LTD.;SUMITOMO ELECTRIC INDUSTRIES, LTD.