| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board and a printed circuit board are provided to improve the degree of the freedom of the design of a circuit pattern using a bump structure. CONSTITUTION: A printed circuit board includes a metal bump which connects an internal circuit pattern(121) and an external circuit pattern(171) in a second insulating layer(160). The metal bump is composed of a first bump(140) and a second bump(150) which are classified into a stepped structure. The first bump and the second bump are formed with one material of Cu(Copper), Ag(Argentum), Sn(Stannum), Au(Aurum), Ni(Nickel), and Pd(Palladium). The end portion of the upper side of the second bump and the connection surface of the first bump have a positive curved surface. The external circuit pattern and internal circuit pattern are connected with the metal bump. A connection pad layer is formed in the upper side of the second bump and the upper side of the connection surface of the circuit pattern. The connection pad layer is formed into the structure of a single layer or a multilayer which consists of one or a compound more than two among the Cu, Ag, Sn, Au, Ni, and Pd.
|
