| 摘要 |
A method comprises generating a vapour of a material from a source target comprising a plurality of separate solid pieces 10, 16 supported on a surface of a base 14, in a configuration in which the plurality of solid pieces of target material 10, 16 are arranged at two or more levels to cover the whole of the surface of the base 14 whilst providing a gap between adjacent pieces at the same level, and depositing the material from the vapour onto a substrate. The base 14 acts as a backing plate, on which some of the solid pieces 10 may be joined, e.g. with solder 12. The arrangement of separate solid pieces 10, 16 allows the base 14 to be wholly covered, to prevent unwanted sputtering of base material. The separate solid pieces preferably comprises tiles 10 mounted on the base 14 (see figure 4), and wires 16 located in recesses 18 in the base 14 at the point where adjacent tiles 10 meet. The wires 16 may be placed in the recesses 18 prior to fixing the tiles 10 on the base (as shown), or may be forced through gaps between the tiles 10 after fixing so that they lie in the recesses 18 (figure 3), or may be inserted from the side into the recesses after the tiles 10 are fixed in place (figure 4). The base 14 may be made of copper, with the target material 10, 16 being a noble metal such as gold. |
